Phani Suresh Paladugu. 2026. “Hybrid 2.5D 3D Integration of Photonic Chiplets and Compute Dies for Scalable Co-Packaged Optical Interconnects in AI Data Centers”. Emerging Frontiers Library for The American Journal of Engineering and Technology 8 (03):1-19. https://emergingsociety.org/index.php/efltajet/article/view/1105.