PHANI SURESH PALADUGU. Hybrid 2.5D/3D Integration of Photonic Chiplets and Compute Dies for Scalable Co-Packaged Optical Interconnects in AI Data Centers. Emerging Frontiers Library for The American Journal of Engineering and Technology, [S. l.], v. 8, n. 03, p. 1–19, 2026. Disponível em: https://emergingsociety.org/index.php/efltajet/article/view/1105. Acesso em: 13 may. 2026.